Posts
Legacy: Where it all started
As we are halfway through the last term of the 2023 to 2024 academic year I’d like to spend some time to show what this club looked like 8 years ago and its humble beginnings.
Overview OSU Overclocking was founded as a competition-based outlet for students interested in electronics packaging and thermal management. The founders identified a need for students who wanted experiential learning opportunities that would directly enable them to be impactful in tech jobs on day one.
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Scatterbencher & Elmor Labs
On April 20th, OSU Overclocking had the opportunity to host Scatterbencher & Elmor Labs’ Pieter and Jon.
Coined “the Lebron James and Kobe Bryant of overclocking” by our club president Walker, they 100% lived up to the hype. Alongside the experience being a blast, we were able to take a lot of insight away from their experience in overclocking.
One of our most prominent takeaways from their visit was their framework for setting world-records.
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G.Skill Comp Prep Work
The big event for there year is upon us! Thanks to our partners we are setup to a shot at qualifying for the top 9 in this years G.Skill World Cup. We are attempting to qualify 3 to 4 members on separate hardware. These members will be competing on Intel’s latest 13th and 14th gen processors paired with ASUS Z790 Apex Encore board’s we are setup to give those competing a serious run for their money.
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Leidenfrost Pot Dev Update
Our Leidenfrost pot team is nearing completion on the first stage of development of our own custom pot design to accept Leidenfrost reducing plates to help improve the heat transfer from the copper heatsink/pot to the LN2 by facilitating a reduction in the Leidenfrost effect.
Images of the iterations of pot design and the current machined copper block: The Leidenfrost effect is the when a fluid encounters a hotplate, and the rapid boiling of the liquid creates a gas vapor layer between the liquid and the hot plate.
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Immersion Case Dev Update
We are almost done with final dry fitting with all panels now machined out, all that’s left is adding the pass through for power, USB type-c connection, and display out.
We have already ordered a 12v power supply to run 3 cables into the case to do power delivery to the CPU and GPU and to connect with a pico power supply for the 24-pin motherboard power delivery.
we have achieved the goal originally set out to be under a 2 liter volume to save on the 2 phase dielectric fluid that we are using.
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